Scalable up to 64 layers with board thicknesses from 0.25mm to 10.0mm. Engineered for high-density, reliable electronic products with strict impedance control.

Dynamic polyimide solutions down to 0.03mm thickness, designed to fold over edges, optimize spatial constraints, and reduce overall package weight.

Advanced microvia technology supporting up to 48 layers (4+N+4) for superior electrical performance, dense wiring, and optimized signal integrity.

Utilizing aluminum substrates and up to 12oz inner/outer copper for superior heat dissipation in high-power industrial and automotive equipment.

End-to-end engineering support including schematic capture, high-speed and high-density routing, and complete EMI/EMC management.

Comprehensive Design for Manufacturability (DFM) reviews and 100% bed-of-nails netlist electrical testing to ensure zero opens or shorts.