Our Capabilities
Rigid & HDI PCBs
High-density interconnects scalable up to 64 layers, featuring precise impedance control (+/- 8%) and advanced FR4 materials.
Flex & Rigid-Flex
Dynamic polyimide solutions designed to optimize spatial constraints and maintain signal integrity in compact footprints.
Heavy Copper & Metal Clad
Aluminum substrates and high-copper weights providing superior thermal management for high-temperature equipment.
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25 Years of Engineering Excellence
Over the last 25 years, we have evolved from a specialized fabrication shop into a global manufacturing powerhouse, delivering everything from standard rigid boards to complex 64-layer HDI and Rigid-Flex solutions. Backed by decades of rigorous quality control and technical innovation, we provide the stability and expertise that tier-1 global enterprises demand.
Scaled capabilities from early standard FR4 routing to today’s ultra-precise 3mil/3mil HDI, Heavy Copper, and complex Rigid-Flex solutions.
Grew from our Hong Kong roots to establish world-class manufacturing centers in China and Taiwan, with design hubs in the US and India.
25 years of building resilient supply chains for blue-chip clients across aerospace, industrial, and consumer electronics.
